YAMAHA hybrid mounting equipment YRH10
Date:2023-04-06    Hits:241
Yamaha's independently developed hybrid mounting equipment suitable for modular product production and capable of achieving mixed mounting of semiconductor and SMD components

1. Hybrid mounting of semiconductor components and SMD components



2. High speed/high-precision mounting


Accuracy ± 15 μ M (cpk ≥ 1.0)


Mounting speed 10800CPH (during chip feeding)



3. Improved component feeding, capable of supporting electric feeders and equipped with sufficient options



4. Can correspond to various production processes


 


SURFACE MOUNT EQUIPMENT HYBRID MOUNTING EQUIPMENT SOLDER PASTE PRINTER YAMAHA DISPENSER AOI SPI 其他检查装置 REFLOW CLEANING EQUIPMENT INKJET PRINTER STORAGE SYSTEM PARTS SUPPORT SYSTEMS AND SOFTWARE

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